Optical film stress measurement tool

Summary

The tender concerns a 200 mm automated film stress and wafer bow analysis system for VTT Micronova cleanroom. The supplier must provide a room-temperature measurement system, a cassette load lock, a wafer-handling robot, a programmable automatic wafer scanning system and analysis software. The equipment must be suitable for use inside a clean room and comply with all technical requirements, performance specifications and acceptance criteria set out in the tender document annexes. Partial tenders are not accepted. Award is based on the economically most advantageous tender, with price weighted at 80% and quality at 20%.