Tender detail

SMD placement machine

Summary

The tender concerns the purchase of a new SMD placement machine. The system is intended to support teaching, research and student development projects in electronics manufacturing and must enable precise and efficient placement of printed circuit boards and other substrates. The machine must be flexible, modularly expandable, easy to program and suitable for different component sizes and technologies. The machine-readable notice did not include precise exclusion, qualification or compliance requirements; these must be checked in the tender documents.

Reference number
369327-2026
Buyer
Technische Universität Ilmenau, Dezernat Finanzen, Zentrale Vergabestelle
Country
Germany (DEU)
Procedure
Open procedure
CPV
42660000 Soldering, brazing and welding tools, surface tempering and hot-spraying machines and equipment
Deadline
2026-06-23
Status
Open
Contract subject
Supplies
Estimated value
Not published
Source
TED

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