Tender detail
Wafer metrology
Summary
The tender concerns a semi-automatic wafer metrology tool for measuring substrates used in the semiconductor industry. The tool must measure total thickness, TTV, warp, bow, metallization bumps, trench or via depth and geometric factors, and it must be suitable for installation in an ISO 4 classified cleanroom. The machine-readable notice did not include precise qualification and compliance requirements; these must be checked in the tender documents.
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