Tender detail
Miscellaneous general- and special-purpose machinery – CONTRACT FOR THE SUPPLY OF A LASER MACHINING SYSTEM FOR RADIOFREQUENCY SUBSTRATES, IN THE FRAMEWORK OF THE RECOVERY, TRANSFORMATION AND RESILIENCE PLAN – FINANCED BY THE EUROPEAN UNION - NEXT GENERATION EU THROUGH THE “UNICO CHIPS JU – INTEGRATED PHOTONICS PILOT LINE” PROGRAMME, AND THE HORIZON EUROPE AND DIGITAL EUROPE PROGRAMMES
Summary
The tender concerns the purchase of a laser machining system for radiofrequency substrates, including any necessary accessories or auxiliary equipment to ensure the operability of the PIXEurope pilot line. The machine-readable notice did not include precise qualification, exclusion or compliance requirements; these must be checked in the tender documents.
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