Plasma-enhanced atomic layer deposition system

Summary

The tender concerns a plasma-enhanced atomic layer deposition system (PE-ALD) for thin-film deposition. The system must be suitable for depositing thin films on different substrates, from single-chip format (5 x 5 mm²) up to at least 150 mm wafers. It must support reproducible deposition processes for various conductive, semiconducting and dielectric layers, including multilayer processing without breaking vacuum. A control PC with monitor, keyboard, mouse, the necessary software licences and a current operating system (Windows 11) must be supplied.