Tender detail
Metrology SEM+FIB system
Summary
The tender concerns the supply of one SEM+FIB system. The equipment will be used for material milling (cutting), 3D characterisation and cross-section analysis of layers grown on InP substrates. It must also be suitable for structures containing polymer-based planarisation layers, SiOx or SiNx dielectric layers, and TiPtAu or NiGeAu metal layers.
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