Tender detail
Plasma-enhanced atomic layer deposition system
Summary
The tender concerns a plasma-enhanced atomic layer deposition system for thin-film deposition on different substrates, from single-chip format up to at least 150 mm wafers. The system must enable reproducible deposition processes for conductive, semiconductive and dielectric layers, including multilayer processing without breaking vacuum. A control PC with monitor, keyboard, mouse, the required software licences and Windows 11 operating system must be supplied.
More tender information after sign-in
The public view shows key tender details. Sign in to open official links, documents and AI tender support.