Tender detail
Edge-handling sputtering cluster tool
Summary
This tender concerns an edge-handling sputtering cluster tool for 200 mm wafers for VTT Micronova cleanroom semiconductor front-end use. The equipment must allow wafers to be mechanically touched only at the wafer edge during transport and processing, and to be flipped in vacuum between process steps. The exact technical requirements, exclusion grounds and qualification criteria must be checked in the tender documents.
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