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Tender detail

Edge-handling sputtering cluster tool

Summary

The tender concerns the supply of an edge-handling sputtering cluster tool for the VTT Micronova cleanroom semiconductor front end. The equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability, including a deposition chamber with four magnetron sputtering sources. The detailed technical requirements are set out in the tender documents.

Reference number
548119-2026
Buyer
VTT Technical Research Centre of Finland Ltd
Country
Finland (FIN)
Procedure
Open procedure
CPV
38000000 Laboratory, optical and precision equipments (excl. glasses)
Deadline
2026-08-13
Status
Open
Contract subject
Supplies
Estimated value
Not published
Source
TED
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