Micro milling machine

Summary

This is not a procurement procedure or a call for tenders, but an information request and market survey for a potential future equipment purchase. The contracting authority wants an overview of micro milling machines available on the market and of related management applications, maintenance and support services. The system should be able to remove electronic components and prepare boards, decapsulate package front sides, remove electromagnetic shielding, remove PCBs, thin die backside layers and delayer die front sides. Preferably, the machine should operate as a standalone system without an external computer and should include a camera system, automated sample levelling, the ability to process warped circuit boards, tool changes without a wrench or spanner, and positional accuracy of at least 1 µm. Interested suppliers may submit materials related to the equipment by 31 July 2026.